Desmontagem de placas de circuito impresso usando ar quente e força centrífuga
DOI:
https://doi.org/10.5902/2236117036837Palavras-chave:
Resíduos de equipamentos eletrônicos, Reciclagem, DesmontagemResumo
Os Resíduos de Equipamentos Eletrônicos são uma fonte significativa de material que pode contribuir para reduzir impactos ambientais das etapas de extração e descarte; portanto, é necessário desenvolver processos de reciclagem eficientes para componentes como as placas de circuito impresso (PCIs). Os métodos atuais de reciclagem de PCIs podem ser otimizados pela prévia desmontagem desses componentes. Neste trabalho, uma centrífuga foi especialmente projetada e fabricada para desmontar PCIs de fontes (PS-PCBs) e chips de memória (ME-PCBs) de computadores pessoais, por meio da combinação de fluxo de ar quente e centrifugação. OS resultados mostraram que o equipamento foi capaz de separar solda, componentes eletrônicos (ECs) e substratos das placas, contanto que componentes perigosos e partes plásticas sejam previamente removidos. Análises com microscópio eletrônico de varredura com módulo de energia dispersiva de raio-x integrado mostraram que a solda recuperada apresentou menos de 3% em massa, de contaminação, podendo assim substituir a borra de solda comumente usada na produção de novas soldas. As taxas de recuperação de componentes chegaram a 94% no caso das PS-PCB e 32% para as ME-PCBs, e uma vez que componentes como os indutores não foram visivelmente danificados no processo, as possibilidades de reutilizá-los podem ser investigadas.
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