Disassembly of waste printed circuit boards using air heating and centrifugal force





Waste electric and electronic equipment, Recycling, Disassembly


Waste electrical and electronic equipment is a significant source of material that can contribute to reduce environmental impacts associated to extraction and discard stages; therefore, it is necessary to develop efficient recycling processes for components such as Printed Circuit Boards (PCBs). Current methods for PCB recycling may be optimized by previous disassembly of such components. In the work reported here, an especially designed and manufactured centrifuge was employed to disassemble PCBs from power supplies (PS-PCBs) and memory chips (ME-PCBs) of personal computers (PCs), through combination of hot air flow and centrifugal force. The results showed that the device was capable of separating tin solder, electronic components (EC) and PCB substrate, as long as hazardous components and plastic parts are previously removed. A scanning electron microscope (SEM) with combined energy dispersive X-ray (EDX) analyzer showed that the recovered solder had under 3%wt of contamination; therefore, it can be employed in the production of new soldering material, replacing the more commonly used solder dross. EC recovery rates were up to 94%wt for PS-PCBs and 32%wt for ME-PCBs, and once components such as inductors were not visibly damaged in the process, possibilities of reusing recovered components may be further investigated.


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Author Biographies

Ricardo Soares Rubin, University of São Paulo

PhD in Electrical Engineering at the University of São Paulo. Currently is a teacher at the Federal Institute of São Paulo. 

Marco Aurélio Soares de Castro, University of Campinas

Professor at University of Campinas

Dennis Brandão, University of São Paulo

Professor of Electrical Engineering at the University of São Paulo


Almeida, CMVB, Madureira MA, Bonilla SH, Giannetti BF. Assessing the replacement of lead in solders: effects on resource use and human health. J Clean Prod. 2013;47: 457-464.

Bigum M, Brogaard L, Christensen, TH. Metal recovery from high-grade WEEE: a life cycle assessment. J Hazard Mater. 2012;207-208: 8-14.

Bleiwas D, Kelly T. Obsolete Computers, “Gold Mines,” or High-Tech Trash? Resource Recovery from Recycling. United States Department of the Interior / United States Geological Survey. 2001.

Brandstotter M, Knoth R, Kopacek B, Kopacek P. Case study of a printed-wire-board concerning (re)design for environment. IEEE T Electron Pack. 2004;27(1): 26-32.

Chen M, Wang J, Chen H, Ogunseitan OA, Zhang M, Zang H, Hu J. Electronic Waste Disassembly with Industrial Waste Heat. Environ Sci Techol. 2013;47(21): 12409-12416.

Cui J, Forssberg E, Mechanical recycling of waste electric and electronic equipment: a review. J Hazard Mater. 2003;99(3): 243-263.

Das A, Vidyadhar A, Mehrotra SP. A novel flowsheet for the recovery of metal values from waste printed circuit boards. Resour Conserv Recy. 2009;53(8): 464-469.

Dias P, Machado A, Huda N, Bernardes AM. Waste electric and electronic equipment (WEEE) management: A study on the Brazilian recycling routes. J Clean Prod. 2018;174: 7-16.

Duan C, Wen X, Shi C, Zhao Y, Wen B, He Y. Recovery of metals from waste printed circuit boards by a mechanical method using a water medium. J Hazard Mater. 2009;166(1): 478-482.

Duan H, Li J, Liu Y, Yamazaki N, Jiang W. Characterization and inventory of PCDD/Fs and PBDD/Fs emissions from the incineration of waste printed circuit board. Environ Sci Technol. 2001;45(15): 6322–6328.

Feldmann K, Scheller H. Disassembly of electronic products. IEEE Int Symp Electr. 1994:81-86.

Feldmann K, Scheller H. The printed circuit board - A challenge for automated disassembly and for the design of recyclable interconnect devices. Conference on clean electronics products and technology, 1995:186-190.

Hagelüken C. Recycling of Electronic Scrap at Umicore’s Integrated Metals Smelter and Refinery. World of Metallurgy – ERZMETALL. 2006;59 (3): 152-161.

Hanafi J, Jobiliong E, Christiani A, Soenarta DC, Kurniawan J, Irawan J. Material recovery and characterization of PCB from electronic waste. International Conference on Asia Pacific Business Inovation and Technology Management. 2012;57: 331-338.

Hino T, Agawa R, Moriya Y, Nishida M, Tsugita Y, Araki T. Techniques to separate metal from waste printed circuit boards from discarded personal computers. J. Mater Cycles Waste Manag. 2009;11(1): 42-54.

Iji M, Yokoyama S, Recycling of printed wiring boards with mounted electronic components. Circuit World. 1997;23(3): 10-15.

Kaya M. Waste Printed Circuit Board (WPCB) recovery technology: disassembly and desoldering approach. Reference Module in Materials Science and Materials Engineering, Elsevier. 2018.

Koyanaka S, Ohya H, Hitoshi S, Endoh S, Iwata H, Ditl P. Recovering copper from electric cable wastes using a particle shape separation technique. Adv Powder Technol. 1997;8(2): 103–111.

Layiding W, Dong X, Peng M, Guanghong D. Disassembling approaches and quality assurance of electronic components mounted on PCBs. IEEE Int Symp Electr. 2005;116-120.

Lee J, Kim Y, Lee JC. Disassembly and physical separation of electric/electronic components in printed circuit boards (PCB). J Hazard Mater. 2001;241-242: 392-399.

Li J, Shrivastava P, Gao Z, Zhang HC. Printed circuit board recycling: a state-of-art survey. IEEE T Electron Pack. 2004;27(1): 33-42.

Long L, Sun S, Zhong S, Dai W, Liu J, Song W. Using vacuum pyrolysis and mechanical processing for recycling waste printed circuit board. J Hazard Mater. 2010;177(1-3): 626-632.

Lucheva B, Tsonev T, Iliev P. Recycling of Lead Solder Dross, Generated from PCB Manufacturing. JOM-J Min Met Mat S. 2011;63(8): 18-22.

Lyman T, Gerlach CH. Metals handbook. 8th ed. Cleveland, Ohio: American Society for Metals, 1954. 184 p.

Park YJ, Fray DJ. Recovery of high purity precious metals from printed circuit boards. J Hazard Mater. 2009;164(2-3): 1152-1158.

Puckett J, Smith T. Exporting harm: the high-tech trashing of Asia. The Basel Action Network, San Jose / Silicon Valley Toxics Coalition, Seattle. 2002.

Statista. Shipment forecast of laptops, desktop PCs and tablets worldwide from 2010 to 2022 (in million units). Available from: https://www.statista.com/statistics/272595/global-shipments-forecast-for-tablets-laptops-and-desktop-pcs/.

UNEP – United Nations Environmental Programme. Recycling - From e-waste to resources - Final Report. Sustainable Innovation and Technology Transfer Industrial Sector Studies. 2009.

Veit HM, Bernardes AM, Ferreira JZ, Tenório JAS, Malfatti CF. Recovery of copper from printed circuit boards scraps by mechanical processing and electrometallurgy. J Hazard Mater. 2006;137(3): 1704-1709.

Veit HM, Pereira CC, Bernardes AM. Utilization of magnetic and electrostatic separation in the recycling of printed circuit boards scrap. Waste Manage. 2005;25(1):, 67-74.

Wang J, Guo J, Xu, Z. An environmentally friendly technology of disassembling electronic components from waste printed circuit boards. Waste Manage. 2016;53(7): 218-224.

Xu J, Lu S, Fu D. Recovery of hydrochloric acid from the waste acid solution by diffusion dialysis. J Hazard Mater. 2009;165(1–3): 832–837.

Youssef C, Ameer S, Hisham A, Naveena S, Saeed N, Taleb I. Recovery of Gold, Silver, Palladium, and Copper from Waste Printed Circuit Boards. Proceedings of the International Conference on Chemical, Civil and Environment engineering (ICCEE'2012), 2012 24-25 mar, Dubai. p. 226-234.

Yu J, Williams E, Ju M. Review and prospects of recycling methods for waste printed circuit boards. IEEE I Symp Sust Sys. 2009;1-5.




How to Cite

Rubin, R. S., Castro, M. A. S. de, & Brandão, D. (2019). Disassembly of waste printed circuit boards using air heating and centrifugal force. Revista Eletrônica Em Gestão, Educação E Tecnologia Ambiental, 23, e28. https://doi.org/10.5902/2236117036837




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